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UKUBOPHELA NGEE-WIRE

IPHEPHA LEENKCUKACHA EZISEKELWE YI-KNOWLEDGE

Yintoni iWire Bonding?

Ukubopha ngentambo yindlela apho ucingo oluthambileyo olunobude obuncinci besinyithi lunamatheliswa kumphezulu wesinyithi ohambelanayo ngaphandle kokusebenzisa i-solder, i-flux, kwaye kwezinye iimeko kusetyenziswe ubushushu obungaphezulu kwe-150 degrees Celsius. Iintsimbi ezithambileyo ziquka iGolide (Au), iCopper (Cu), iSilver (Ag), iAluminiyam (Al) kunye nee-alloys ezifana nePalladium-Silver (PdAg) kunye nezinye.

Ukuqonda Iindlela Zokubopha Iintambo kunye Neenkqubo Zezicelo Zokuhlanganisa Ii-Micro Electronics.
Iindlela / Iinkqubo Zokubopha Iiwedge: IRibhoni, Ibhola yeThermosonic kunye neWedge Bond yeUltrasonic
Ukubopha ngentambo yindlela yokwenza unxibelelwano phakathi kwesekethe edibeneyo (IC) okanye isixhobo se-semiconductor esifanayo kunye nephakheji yaso okanye ifreyimu ye-lead ngexesha lokwenziwa. Ikwasetyenziswa ngoku ukubonelela ngonxibelelwano lombane kwiindibano zepakethe yebhetri yeLithium-ion. Ukubopha ngentambo ngokuqhelekileyo kuthathwa njengeyona ndlela ingabizi kakhulu kwaye iguquguqukayo kwiitekhnoloji zokudibanisa ze-microelectronic ezikhoyo, kwaye isetyenziswa kwiiphakheji ezininzi ze-semiconductor eziveliswayo namhlanje. Kukho iindlela ezahlukeneyo zokubopha ngentambo, ezibandakanya: Ukubopha ngentambo yeThermo-Compression:
I-thermo-compression wire bonding (edityaniswe kwiindawo ezinokwenzeka (ngokuqhelekileyo i-Au) kunye phantsi kwamandla okubamba kunye namaqondo obushushu aphezulu e-interface, aqhele ukuba ngaphezulu kwama-300°C, ukuvelisa i-weld), yaqalwa yaphuhliswa ngeminyaka yoo-1950 kwii-microelectronics interconnects, nangona kunjalo oku kwatshintshwa ngokukhawuleza yi-Ultrasonic & Thermosonic bonding ngeminyaka yoo-1960 njengetekhnoloji yokudibanisa ebalaseleyo. I-thermo-compression bonding isasetyenziswa kwizicelo ze-niche namhlanje, kodwa ngokubanzi iyathintelwa ngabavelisi ngenxa yamaqondo obushushu aphezulu (ahlala ewonakalisa) e-interface afunekayo ukuze kwenziwe i-bonding ephumelelayo. I-Ultrasonic Wedge Wire Bonding:
Kwiminyaka yoo-1960, i-Ultrasonic wedge wire bonding yaba yindlela ephambili yokudibanisa. Ukusetyenziswa kwe-high frequency vibration (nge-transducer ephendulayo) kwisixhobo sokudibanisa ngamandla okubamba ngaxeshanye, kwavumela ukuba iintambo ze-Aluminium kunye neGolide zifakwe kwiqondo lobushushu begumbi. Olu vibration lwe-Ultrasonic lunceda ekususeni izinto ezingcolisayo (ii-oxides, ukungcola, njl.njl.) kwiindawo zokudibanisa ekuqaleni komjikelo wokudibanisa, kunye nokukhuthaza ukukhula kwe-intermetallic ukuze kuphuhliswe kwaye kuqiniswe i-bond. Iifrikhwensi eziqhelekileyo zokudibanisa zii-60 - 120 KHz. Indlela ye-ultrasonic wedge ineendlela ezimbini eziphambili zenkqubo: I-wire bonding enkulu (enzima) yeentambo ezinobubanzi obungaphezulu kwe-100µm I-wire bonding entle (encinci) yeentambo ezinobubanzi obungaphantsi kwe-75µm Imizekelo yemijikelo eqhelekileyo yokudibanisa i-Ultrasonic inokufumaneka apha kwi-fine wire kwaye apha kwi-large wire. I-Ultrasonic wedge wire bonding isebenzisa isixhobo esithile sokudibanisa okanye "i-wedge," edla ngokwakhiwa nge-Tungsten Carbide (ye-Aluminium wire) okanye i-Titanium Carbide (ye-Gold wire) kuxhomekeke kwiimfuno zenkqubo kunye nobubanzi beentambo; Kukho nee-wedges ezineencam ze-ceramic zezicelo ezahlukeneyo. I-Thermosonic Wire Bonding:
Apho kufuneka ukufudumeza okongezelelweyo (ngokwesiqhelo kwi-Gold wire, kunye neendawo zokudibanisa ezikumgama we-100 - 250°C), le nkqubo ibizwa ngokuba yi-Thermosonic wire bonding. Oku kuneenzuzo ezinkulu kunenkqubo ye-thermo-compression yendabuko, njengoko kufuneka amaqondo obushushu aphantsi kakhulu kwi-interface (i-Au bonding kubushushu begumbi ikhankanyiwe kodwa ngokwesiqhelo ayithembekanga ngaphandle kobushushu obongezelelweyo). I-Thermosonic Ball Bonding:
Olunye uhlobo lwe-Thermosonic wire bonding yi-Ball Bonding (jonga umjikelo we-ball bond apha). Le ndlela isebenzisa isixhobo se-ceramic capillary bonding phezu koyilo lwendabuko lwe-wedge ukudibanisa iimpawu ezilungileyo kwi-thermo-compression kunye ne-ultrasonic bonding ngaphandle kweziphene. Ukungcangcazela kwe-Thermosonic kuqinisekisa ukuba ubushushu be-interface buhlala buphantsi, ngelixa i-interface yokuqala, i-thermally-compressed ball bond ivumela i-wire kunye ne-secondary bond ukuba zibekwe nakweyiphi na indlela, zingahambelani ne-first bond, nto leyo engumqobo kwi-Ultrasonic wire bonding. Kwimveliso ye-automatic, enevolumu ephezulu, ii-ball bonders zikhawuleza kakhulu kunee-Ultrasonic / Thermosonic (Wedge), okwenza i-Thermosonic ball bonding ibe yiteknoloji ye-interconnect elawulayo kwi-microelectronics kwiminyaka engaphezu kwama-50 edlulileyo.
Ukubopha iribhoni, kusetyenziswa iiteyiphu zesinyithi ezisicaba, bekusoloko kuphambili kwi-RF kunye ne-Microwave electronics kangangamashumi eminyaka (iribhoni ibonelela ngophuculo olukhulu ekulahlekelweni kwesignali [isiphumo solusu] xa kuthelekiswa nocingo olujikelezileyo lwendabuko). Iiribhoni zegolide ezincinci, ezidla ngokuba zifikelela kwi-75µm ububanzi kunye ne-25µm ubukhulu, zibotshelelwa ngenkqubo yeThermosonic enesixhobo esikhulu sokubopha i-wedge esisicaba. Iiribhoni ze-aluminium ezifikelela kwi-2,000µm ububanzi kunye ne-250µm ubukhulu nazo zinokubotshelelwa ngenkqubo ye-Ultrasonic wedge, njengoko imfuneko yokudibanisa i-loop esezantsi, kunye noxinano oluphezulu inyukile.

Yintoni intambo yegolide yokubopha?

Ukubopha ucingo lwegolide yinkqubo apho ucingo lwegolide lubotshelelwa kwiindawo ezimbini kwindibano ukuze kwenziwe unxibelelwano okanye indlela eqhuba umbane. Ubushushu, ii-ultrasonic, kunye namandla zonke zisetyenziselwa ukwenza iindawo zokubopha ucingo lwegolide. Inkqubo yokwenza indawo yokubopha iqala ngokwenziwa kwebhola yegolide kwincam yesixhobo sokubopha ucingo, i-capillary. Le bhola icinezelwa kumphezulu wokuhlanganisa oshushu ngelixa kusetyenziswa amandla athile asetyenziswayo kunye nokuphindaphinda kwe-60kHz - 152kHz yentshukumo ye-ultrasonic ngesixhobo. Nje ukuba ikhonkco lokuqala lenziwe, ucingo luya kulawulwa ngendlela elawulwayo ukuze lwenze imo yeluphu efanelekileyo yejometri yendibano. Ikhonkco lesibini, elidla ngokubizwa ngokuba yi-stitch, lenziwa kwenye indawo ngokucinezela ngentambo kunye nokusebenzisa i-clamp ukukrazula ucingo kwikhonkco.

Ukubopha ucingo lwegolide kunika indlela yokudibanisa ngaphakathi kwiipakethe eziqhuba umbane kakhulu, phantse zibe nkulu kunezinye ii-solders. Ukongeza, iingcingo zegolide zinokunyamezela okuphezulu kwe-oxidation xa kuthelekiswa nezinye izinto zengcingo kwaye zithambile kunezinye, nto leyo ebalulekileyo kwiindawo ezinobuthathaka.
Le nkqubo inokwahluka ngokusekwe kwiimfuno zendibano. Ngezixhobo ezibuthathaka, ibhola yegolide ingabekwa kwindawo yesibini yokubopha ukuze kudalwe ibhondi eqinileyo kunye nebhondi "ethambileyo" ukuthintela umonakalo kumphezulu wecandelo. Ngeendawo ezixineneyo, ibhola enye ingasetyenziswa njengendawo yokuqala yeebhondi ezimbini, zenze ibhondi emile okwe-"V". Xa ibhondi yentambo kufuneka iqine ngakumbi, ibhola ingabekwa phezu kwestitshi ukuze yenze ibhondi yokhuseleko, yonyusa uzinzo kunye namandla entambo. Usetyenziso oluninzi olwahlukeneyo kunye notshintsho kwibhondi yentambo phantse alunamda kwaye lunokufezekiswa ngokusebenzisa isoftware ezenzekelayo kwiinkqubo zebhondi yentambo zikaPalomar.